fdp52n20 / FDPF52N20T n-channel unifet tm mosfet ?2007 fairchild semiconductor corporation fdp52n20 / FDPF52N20T rev. c0 www.fairchildsemi.com 1 fdp52n20 / FDPF52N20T n-channel unifet tm mosfet 200 v, 52 a, 49 m? features ? i ds(on) = 41 m? ( typ.) @ v gs = 10 v, i d = 26 a ? low gate charge (typ. 49 nc) ? low c rss ( typ. 66 pf) ? 100% avalanche tested ? rohs compliant description unifet tm mosfet is fairchild semiconductor ? s high voltage mosfet family based on planar stripe and dmos technology. this mosfet is tailored to reduce on-state resistance, and to provide better switching performance and higher av alanche energy strength. this device family is suitable for switching power converter applications such as power factor correction (pfc), flat panel display (fpd) tv power, atx and electronic lamp ballasts. d g s to-220f mosfet maximum ratings t c = 25 o c unless otherwise noted thermal characteristics symbol parameter fdp52n20 FDPF52N20T unit v dss drain to source voltage 200 v v gss gate to source voltage 30 v i d d r a i n c u r r e n t -continuous (t c = 25 o c) 52 52* a -continuous (t c = 100 o c) 33 33* i dm d r a i n c u r r e n t - p u l s e d (note 1) 208 208* a e as single pulsed avalanche energy (note 2) 2520 mj i ar avalanche current (note 1) 52 a e ar repetitive avalanche energy (note 1) 35.7 mj dv/dt peak diode recovery dv/dt (note 3) 4.5 v/ns p d power dissipation (t c = 25 o c) 357 38.5 w - derate above 25 o c 2.86 0.3 w/ o c t j , t stg operating and storage temperature range -55 to +150 o c t l maximum lead temperature for soldering purpose, 1/8? from case for 5 seconds 300 o c symbol parameter fdp52n20 FDPF52N20T unit r jc thermal resistance, junction to case , max. 0.35 3.3 o c/w r cs thermal resistance, case to sink , typ. 0.5 - r ja thermal resistance, junction to ambient, max. 62.5 62.5 *drain current limited by maximum junction temperature applications ? pdp tv ? lighting ? uninterruptible power supply ? ac-dc power supply april 2013 g d s g d s to- 220
2 package marking and ordering information t c = 25 o c unless otherwise noted electrical characteristics off characteristics on characteristics dynamic characteristics switching characteristics drain-source diod e charac teristics device marking device package reel size tape width quantity fdp52n20 fdp52n20 to-220 - - 50 FDPF52N20T FDPF52N20T to-220f - - 50 symbol parameter test conditions min. typ. max. unit bv dss drain to source breakdown voltage i d = 250 a, v gs = 0v, t j = 25 o c 200 - - v ? bv dss / ? t j breakdown voltage temperature coefficient i d = 250 a, referenced to 25 o c-0.2-v/ o c i dss zero gate voltage drain current v ds = 200v, v gs = 0v - - 1 a v ds = 160v, t c = 125 o c--1 0 i gss gate to body leakage current v gs = 30v, v ds = 0v - - 100 na v gs(th) gate threshold voltage v gs = v ds , i d = 250 a3 . 0-5 . 0v r ds(on) static drain to source on resistance v gs = 10v, i d = 26a - 0.041 0.049 ? g fs forward transconductance v ds = 40v, i d = 26a (note 4) -35-s c iss input capacitance v ds = 25v, v gs = 0v f = 1mhz - 2230 2900 pf c oss output capacitance - 540 700 pf c rss reverse transfer capacitance - 66 100 pf q g(tot) total gate charge at 10v v ds = 160v, i d = 52a v gs = 10v (note 4, 5) -4963nc q gs gate to source gate charge - 19 - nc q gd gate to drain ?miller? charge - 24 - nc t d(on) turn-on delay time v dd = 100v, i d = 20a r g = 25? (note 4, 5) - 53 115 ns t r turn-on rise time - 175 359 ns t d(off) turn-off delay time - 48 107 ns t f turn-off fall time - 29 68 ns i s maximum continuous drain to source diode forward current - - 52 a i sm maximum pulsed drain to source diode forward current - - 204 a v sd drain to source diode forward voltage v gs = 0v, i sd = 52a - - 1.5 v t rr reverse recovery time v gs = 0v, i sd = 52a di f /dt = 100a/ s (note 4) - 162 - ns q rr reverse recovery charge - 1.3 - c notes: 1. repetitive rating: pulse width limited by maximum junction temperature 2. l = 1.4mh, i as = 52a, v dd = 50v, r g = 25 ? , starting t j = 25 c 3. i sd 52a, di/dt 200a/ s, v dd bv dss , starting t j = 25 c 4. pulse test: pulse width 300 s, duty cycle 2% 5. essentially independent of operating temperature typical characteristics fdp52n20 / FDPF52N20T n-channel unifet tm mosfet ?2007 fairchild semiconductor corporation fdp52n20 / FDPF52N20T rev. c0 www.fairchildsemi.com
3 typical performance characteristics figure 1. on-region characteristics figure 2. transfer characteristics figure 3. on-resistance variation vs. figure 4. body diode forward voltage drain current and gate vo ltage variation vs. source current and temperature figure 5. capacitance characteristics figure 6. gate charge characteristics 10 -1 10 0 10 1 10 -1 10 0 10 1 10 2 v gs top : 15.0 v 10.0 v 8.0 v 7.0 v 6.5 v 6.0 v bottom : 5.5 v * notes : 1. 250 s pulse test 2. t c = 25 c i d , drain current [a] v ds , drain-source voltage [v] 24681 01 2 10 0 10 1 10 2 150 c 25 c -55 c * notes : 1 . v ds = 40v 2 . 250 s pulse test i d , drain current [a] v gs , gate-source voltage [v] 0 25 50 75 100 125 150 0.00 0.02 0.04 0.06 0.08 0.10 0.12 v gs = 20v v gs = 10v * note : t j = 25 c r ds(on) [ ? ], drain-source on-resistance i d , drain current [a] 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 10 0 10 1 10 2 150 ? * notes : 1 . v gs = 0v 2 . 250 s pulse test 25 ? i dr , reverse drain current [a] v sd , source-drain voltage [v] 10 -1 10 0 10 1 0 1000 2000 3000 4000 5000 6000 c iss = c gs + c gd (c ds = shorted) c oss = c ds + c gd c rss = c gd * note ; 1. v gs = 0 v 2. f = 1 mhz c rss c oss c iss capacitances [pf] v ds , drain-source voltage [v] 0 102030405060 0 2 4 6 8 10 12 v ds = 100v v ds = 40v v ds = 160v * note : i d = 52a v gs , gate-source voltage [v] q g , total gate charge [nc] fdp52n20 / FDPF52N20T n-channel unifet tm mosfet ?2007 fairchild semiconductor corporation fdp52n20 / FDPF52N20T rev. & |